@article{article, title  = {{Foreword: Pb-free solders and emerging interconnect and packaging technologies}},

 url = {{}},

 year = {{2010}},

 month = {{9}},

 author = {{Lin KL and Kang SK and Duh JG and Lee A and Bieler T and Turbini L and Sidhu R and Guo F and Anderson I}},

 doi = {{10.1007/s11664-010-1389-8}},

 volume = {{39}},

 journal = {{Journal of Electronic Materials}},

 issue = {{12}},

 pages = {{2503}},

 note = {{Accessed on 2025/06/09}}}