TY  - JOUR

T1  - Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part II. Creep behavior of bulk solder and solder/copper joints

JO  - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

PY  - 2007/12/08

AU  - Sidhu RS

AU  - Deng X

AU  - Chawla N

ED  - 

DO  - DOI: 10.1007/s11661-007-9412-2

VL  - 39

IS  - 2

SP  - 349

EP  - 362

Y2  - 2025/06/09

ER  -