@article{article, title  = {{Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part II. Creep behavior of bulk solder and solder/copper joints}},

 url = {{}},

 year = {{2007}},

 month = {{12}},

 author = {{Sidhu RS and Deng X and Chawla N}},

 doi = {{10.1007/s11661-007-9412-2}},

 volume = {{39}},

 journal = {{Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science}},

 issue = {{2}},

 pages = {{349-362}},

 note = {{Accessed on 2025/06/09}}}