TY  - JOUR

T1  - Thermal fatigue behavior of Sn-Rich (Pb-Free) solders

JO  - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

PY  - 2008/02/16

AU  - Sidhu RS

AU  - Chawla N

ED  - 

DO  - DOI: 10.1007/s11661-008-9480-y

VL  - 39 A

IS  - 4

SP  - 799

EP  - 810

Y2  - 2025/06/09

ER  -