TY  - JOUR

T1  - Tackling the copper wrap plate requirement; Wrap plating improves reliability of via structures, but conventional techniques increase surface copper thickness, limiting HDI and other fine-line designs

JO  - Printed Circuit Design and Fab

PY  - 2009/07/01

AU  - Sidhu R

ED  - 

VL  - 26

IS  - 7

SP  - 23

EP  - 26

Y2  - 2025/06/09

ER  -