@article{article, title  = {{Tackling the copper wrap plate requirement; Wrap plating improves reliability of via structures, but conventional techniques increase surface copper thickness, limiting HDI and other fine-line designs}},

 url = {{}},

 year = {{2009}},

 month = {{7}},

 author = {{Sidhu R}},

 volume = {{26}},

 journal = {{Printed Circuit Design and Fab}},

 issue = {{7}},

 pages = {{23-26}},

 note = {{Accessed on 2025/06/09}}}